半导体行业精密工具

宣传画册

半导体行业精密工具
硅片、蓝宝石片开槽砂轮

产品详细信息

Grinding wheel for bevel machining of semiconductor material substrates. 

Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

 

  Beveling silicon wafers Beveling sapphire wafers
Notch machining Wheel size φ3.8×36L×11T×8U×1.4X φ3.8×36L×11T×8U×1.4X

 

 

 


Features

 


Even and ne diamond layer minimizes processing damage. 
Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life. 
Highly precise slotted shape and nishing technology support various wafer shapes. 
Copper-less supported.

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